Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication

Author:

Worgull M.,Hétu J. -F.,Kabanemi K. K.,Heckele M.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. BeckerH, Heim U (2000) Hot embossing as a method for the fabrication of polymer high aspect ratio structures. Sensors Actuators 83:130–135

2. Dittrich H, Heckele M, Schomburg WK (2000) Tool development for hot embossing of double-sided microstructured molded parts, Forschungszentrum Karlsruhe, FZKA-Bericht 7058

3. Hanemann T, Heckele M, Piotter V (2000) Current status of micromolding technology. Polymer News 25:224–229

4. Heckele M, Schomburg WK (2004) Review on micro molding of thermoplastic polymers. J Micromech Microeng 14:R1–R14

5. Heckele M, Bacher W, Hanemann T, Ulrich H (1997) Hot embossing and injection molding for microoptical components. In: SPIE Conference, San Diego

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