Manufacture of microfluidic glass chips by deep plasma etching, femtosecond laser ablation, and anodic bonding-Reference-Cited by-同舟云学术

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Manufacture of microfluidic glass chips by deep plasma etching, femtosecond laser ablation, and anodic bonding

Published:2010-01-26 Issue:8-9 Volume:16 Page:1485-1493
ISSN:0946-7076
Container-title:Microsystem Technologies
language:en
Short-container-title:Microsyst Technol

Author:

Queste S.,Salut R.,Clatot S.,Rauch J.-Y.,Khan Malek Chantal G.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s00542-010-1020-1.pdf

Reference36 articles.

1. Akashi T, Yoshimura Y (2006) Deep reactive ion etching of borosilicate glass using an anodically bonded silicon wafer as etching mask. J Micromech Microeng 16:1051–1056

2. An R, Li Y, Dou Y, Liu D, Yang H, Gong Q (2006) Water-assisted drilling of microfluidic chambers inside silica glass with femtosecond laser pulses. Appl Phys A 83:27–29

3. An R, Uram JD, Yusko EC, Ke K, Mayer M, Hunt AJ (2008) Ultrafast laser fabrication of submicrometer pores in borosilicate glass. Opt Lett 33(10):1153–1155

4. Baram A, Naftali M (2006) Dry etching of deep cavities in Pyrex for MEMS applications using standard lithography. J Micromech Microeng 16:2287–2291

5. Bellouard Y, Said A, Dugan M, Bado P (2004) Fabrication of high-aspect ratio, micro-fluidic channels and tunnels using femtosecond laser pulses and chemical etching. Opt Express 12(10):2120–2129

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