Uniformity study of nickel thin-film microstructure deposited by electroplating-Reference-Cited by-同舟云学术

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Uniformity study of nickel thin-film microstructure deposited by electroplating

Published:2009-01-14 Issue:4 Volume:15 Page:505-510
ISSN:0946-7076
Container-title:Microsystem Technologies
language:en
Short-container-title:Microsyst Technol

Author:

Li Jia-dong,Zhang Ping,Wu Yi-hui,Liu Yong-shun,Xuan Ming

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s00542-008-0754-5.pdf

Reference12 articles.

1. Du LQ, Liu HJ, Qin J, Zhu SM (2007) Study on uniformity of micro-electroformed device. Opt Precision Eng 15:69–75 in chinese

2. Ehdizadeh S, Dukovic JO, Andricacos PC, Romankiw LT (1992) the influence of lithographic patterning on current distribution: a model for the microfabrication by electrodeposition. J Electrochem Soc 139:78–91. doi: 10.1149/1.2069205

3. Flake J, Solomentsev Y, Cooper J, Cooper K (2003) Wafer-scale profile evolution of electrochemically deposited copper films. J Electrochem Soc 150:C195–C201. doi: 10.1149/1.1554723

4. Green TA, Liew MJ, Roy S (2003) Electrodeposition of gold from a thiosulfate-sulfite bath for microelectronic applications. J Electrochem Soc 150:C104–C110. doi: 10.1149/1.1541006

5. Judy JW, Muller RS, Zappe HH (1995) Magnetic microactuation of polysilicon flexure structures. J Microelectromech Syst 4:162–169. doi: 10.1109/84.475542

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