Electrodeposition of Gold from a Thiosulfate-Sulfite Bath for Microelectronic Applications-Reference-Cited by-同舟云学术

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Electrodeposition of Gold from a Thiosulfate-Sulfite Bath for Microelectronic Applications

Published:2003 Issue:3 Volume:150 Page:C104
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Green T. A.,Liew M.-J.,Roy S.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Microbump Formation by Noncyanide Gold Electroplating

2. K. Kosaki, M. Matsuoka, Y. Seiwa, S. Orisaka, K. Nishitani, and M. Otsubo,Electrochemical Microfabrication, M. Datta, K. Sheppard and D. Snyder, Editors, PV 92-3, p. 317, The Electrochemical Society Proceedings Series, Pennington, NJ (1992).

Cited by 52 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Sulfite ion and gold (111) surface interaction mechanism;Physica B: Condensed Matter;2024-07

2. Bottom-up Gold Filling of Trenches in Curved Wafers;Journal of The Electrochemical Society;2024-03-04

3. Direct 3D microprinting of highly conductive gold structures via localized electrodeposition;Materials & Design;2023-03

4. Study on Laser Induced Electrodeposition of Localized Gold Coating on Stainless Steel;CHIN J LASERS;2022

5. The role of thiosulfate and sulfite in gold thiosulfate electrowinning process: An electrochemical view;Process Safety and Environmental Protection;2022-10

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