Modeling of chemical mechanical polishing processes by cellular automata and finite element/matlab integration methods-Reference-Cited by-同舟云学术

Modeling of chemical mechanical polishing processes by cellular automata and finite element/matlab integration methods

Published:2014-08-13 Issue:9 Volume:21 Page:1879-1892
ISSN:0946-7076
Container-title:Microsystem Technologies
language:en
Short-container-title:Microsyst Technol

Author:

Chen Kuo-Shen,Wu Shang-Lun,Yeh Hsiu-Ming

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s00542-014-2302-9.pdf

Reference32 articles.

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4. Chen K-S and Wu S-L (2013) Modeling of chemical mechanical polishing processes by cellular automata and finite element/matlab integration methods. In: Proc. design, test, integration and packaging of MEMS/MOEMS (DTIP’13). Barcelona, pp 85–88

5. Chen K-S, Yeh H-M, Yan J-L, Chen Y-C (2009) Finite element analysis on wafer level CMP contact stress: re-investigated issues and the effects of selected process parameters. Int J Adv Manuf Technol 42:1118–1130

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