A sub-micron metallic electrothermal gripper-Reference-Cited by-同舟云学术

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A sub-micron metallic electrothermal gripper

Published:2009-11-08 Issue:3 Volume:16 Page:367-373
ISSN:0946-7076
Container-title:Microsystem Technologies
language:en
Short-container-title:Microsyst Technol

Author:

Park Daniel Sang-Won,Nallani Arun Kumar,Cha DonKyu,Lee Gil-Sik,Kim Moon J.,Skidmore George,Lee Jeong-Bong,Lee Jeong-Soo

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s00542-009-0939-6.pdf

Reference13 articles.

1. Carrozza MC, Menciassi A, Tiezzi G, Dario P (1998) The development of a LIGA-microfabricated gripper for micromanipulation tasks. J Micromech Microeng 8:141–143

2. Enikov ET, Lazarov K (2003) PCB-integrated metallic thermal micro-actuators. Sens Actuators A 105:76–82

3. Fritz T, Cho HS, Hemker KJ, Mokwa W, Schnakenberg U (2002) Characterization of electroplated nickel. Microsyst Technol 9:87–91

4. Jang JE, Cha SN, Choi Y, Kang DJ, Hasko DG, Jung JE, Kim JM, Amaratunga GAJ (2008) A nanogripper employing aligned multiwall carbon nanotubes. IEEE Trans Nanotechnology 7(4):389–393

5. Kim C-J, Pisano AP, Muller RS (1992) Silicon-processed overhanging microgripper. IEEE J MEMS 1(1):31–36

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