Author:
Kosloh J.,Sackmann J.,Šakalys R.,Liao S.,Gerhardy C.,Schomburg W. K.
Funder
Deutsche Forschungsgemeinschaft
Research Council of Lithuania
China Scholarship Council
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. Altmann B, Ahrens R, Welle A, Dinglreiter H, Schneider M, Schober A (2012) Microstructuring of multiwell plates for three-dimensional cell culture applications by ultrasonic embossing. Biomed Microdevices 14:291–301. doi:
10.1007/s1054401196058
2. Fairbanks HV (1974) Applying ultrasonics to the moulding of plastic powders. Ultrasonics 12(1):22–24. doi:
10.1016/0041-624X(74)90082-1
3. Heckele M, Schomburg WK (2004) Review on micro molding of thermoplastic polymers. J Micromech Microeng 14:R1–R14. doi:
10.1088/0960-1317/14/3/R01
4. Hesse S, Schnell G (2014) Sensoren für die Prozess- und Fabrikautomation. 6. Auflage, Springer Vieweg. doi:
10.1007/978-3-658-05867-8
5. Khuntontong P, Blaser T, Schomburg WK (2008) Ultrasonic micro hot embossing of thermoplastic polymers. In: Proc. 24th Annual Meeting of the Polymer Processing Society, PPS24, Salerno, Italy, June 15–19, pp II.364
Cited by
19 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献