Hot embossing of microstructure with moving induction heating and gas-assisted pressuring

Author:

Kao Ching-Chieh,Ke Kun-Cheng,Hung Wei-Cheng,Yang Sen-YeuORCID

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Chen Q, Zhang L, Chen G (2014) Far infrared-assisted embossing and bonding of poly(methyl methacrylate) microfluidic chips. RSC Adv 4(99):56440–56444

2. Gao H, Tan H, Zhang W, Morton K, Chou SY (2006) Air cushion press for excellent uniformity, high yield, and fast nanoimprint across a 100 mm field. Nano Lett 6(11):2438–2441

3. Goral VN, Hsieh Y-C, Petzold ON, Faris RA, Yuen PK (2011) Hot embossing of plastic microfluidic devices using poly(dimethylsiloxane) molds. J Micromech Microeng 21(1):017002

4. Hocheng H, Wen TT (2008) Innovative approach to uniform imprint of micron and submicron features. J Achiev Mater Manuf Eng 28(1):79–82

5. Hong S-K, Heo Y-M, Kang J (2008) Replication of polymeric micro patterns by rapid thermal pressing with induction heating apparatus. In: 2008 3rd IEEE international conference on nano/micro engineered and molecular systems, pp 911–915

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