New fabrication method for micro-pyramidal vertical probe array for probe cards-Reference-Cited by-同舟云学术

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New fabrication method for micro-pyramidal vertical probe array for probe cards

Published:2009-12-10 Issue:7 Volume:16 Page:1215-1220
ISSN:0946-7076
Container-title:Microsystem Technologies
language:en
Short-container-title:Microsyst Technol

Author:

Lin Tsung-Hung,Yang Hsiharng,Chao Ching-Kong,Yeh Mau-Shiun

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s00542-009-0964-5.pdf

Reference14 articles.

1. Chen L, El-Gomati MM (1999) Field emission studies of tungsten-coated silicon-based field emitters. Ultramicroscopy 79:135–140. doi: 10.1016/S0304-3991(99)00074-1

2. Henry S, McAllister DV, Allen M, Prausnitz M (2000) Microfabricated microneedles: a novel approach to transdermal drug delivery. J Pharm Sci 87:922–925. doi: 10.1021/js980042

3. Huang SH, Tseng FG (2005) Development of a monolithic total internal reflection-based biochip utilizing a microprism array for fluorescence sensing. J Micromech Microeng 15:2235–2242. doi: 10.1088/0960-1317/15/12/004

4. Kataoka K, Itoh T, Inoue K, Suga T (2004) Multi layer electroplated micro spring array for MEMS probe card. In: MEMS2004, 17th IEEE Conf., pp 733–736

5. Kim YM, Yoon HC, Lee JH (2005) Silicon micro probe card using porous silicon micro-machining technology. ETRI J 27:433–438. doi: 10.4218/etrij.05.0104.0080

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fabrication of a micro-tip array mold using a micro-lens mask with proximity printing;Microsystem Technologies;2015-01-18

2. Highly Productive Process Technologies of Cantilever-type Microprobe Arrays for Wafer Level Chip Testing;Transactions on Electrical and Electronic Materials;2013-04-25

3. Fabrication of a guide block for measuring a device with fine pitch area-arrayed solder bumps;Microsystem Technologies;2012-02-09

4. Design and fabrication of a micromachined bilayer cantilever probe card;Journal of Micro/Nanolithography, MEMS, and MOEMS;2010-10-01

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