Highly Productive Process Technologies of Cantilever-type Microprobe Arrays for Wafer Level Chip Testing-Reference-Cited by-同舟云学术

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Highly Productive Process Technologies of Cantilever-type Microprobe Arrays for Wafer Level Chip Testing

Published:2013-04-25 Issue:2 Volume:14 Page:63-66
ISSN:1229-7607
Container-title:Transactions on Electrical and Electronic Materials
language:en
Short-container-title:Transactions on Electrical and Electronic Materials

Author:

Lim Jae-Hwan,Ryu Jee-Youl,Choi Woo-Chang

Publisher

The Korean Institute of Electrical and Electronic Material Engineers

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://ocean.kisti.re.kr/downfile/crosscheck/kieeme/JAKO201312855326311.pdf

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Real-Time Electrical Characteristics of Microprobe Testing Process in Microelectronics Packaging;IEEE Transactions on Semiconductor Manufacturing;2018-02

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