Author:
Masteika V.,Kowal J.,Braitwaite N. St. J.,Rogers T.
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Cited by
7 articles.
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1. Robust Measurement of Bonding Strength for Wafer-to-Wafer 3D Integration;2023 International Conference on Electronics Packaging (ICEP);2023-04-19
2. Wafer Level Back to Back Hybrid Bonding for Multiple Wafer Stacking;2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC);2020-12-02
3. Strength of bonded interfaces;Handbook of Silicon Based MEMS Materials and Technologies;2020
4. Under-water adhesion of rigid spheres on soft, charged surfaces;Journal of Applied Physics;2015-11-21
5. Water Stress Corrosion in Bonded Structures;ECS Journal of Solid State Science and Technology;2015