Author:
Huang De-Shau,Liao Yi-Sheng,Kuo Heng-Jen,Kuo Fang-Jui,Lin Ming-Tzer
Funder
Jabil Green Point Company
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference14 articles.
1. Cheng HH, Huang D, Lin M (2012) Heat dissipation design and analysis of a high power LED array using the finite element method. Microelectron Reliab 52:905–911. doi: 10.1016/j.microrel.2011.05.009
2. Colgan EG, Furman B, Gaynes M, Graham W, LaBianca N, Magerlein JH, Polastre RJ, Rothwell MB, Bezama RJ, Choudhary R, Marston K, Toy H, Wakil J, Zitz J, Schmidt R (2005) A practical implementation of silicon microchannel coolers for high power chips. In: 21st IEEE semi-therm symposium, San Jose, CA, USA, 15 Mar 2005
3. Costa VAF, Lopes AMG (2014) Improved radial heat sink for led lamp cooling. Appl Therm Eng 70:131–138
4. Haque S, Steigerwald D, Rudaz S, Steward B (2003) Packaging challenges of high power LEDs for solid state lighting. In: 36th International Symposium on Microelectronics (IMAPS), Boston, MA, 16–20 Nov 2003
5. Jang D, Yook SJ, Lee KS (2014a) Optimum design of a radial heat sink with a fin-height profile for high-power LED lighting applications. Appl Energy 116:260–268
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献