Optimization of three-dimensional boiling enhancement structure at evaporation surface for high power light emitting diode-Reference-Cited by-同舟云学术

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Optimization of three-dimensional boiling enhancement structure at evaporation surface for high power light emitting diode

Published:2018-07 Issue:7 Volume:28 Page:1404-1412
ISSN:1003-6326
Container-title:Transactions of Nonferrous Metals Society of China
language:en
Short-container-title:Transactions of Nonferrous Metals Society of China

Author:

XIANG Jian-hua,ZHOU Chao,ZHANG Chun-liang,LIU Gui-yun,CHEN Cong-gui,ZHOU Wei

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference18 articles.

1. Thermal investigation of a high brightness LED array package assembly for various placement algorithms [J];YUNG;Applied Thermal Engineering,2014

2. Solid-state lighting: Failure analysis of white LEDs [J];NARENDRAN;Journal of Crystal Growth,2004

3. Heat and fluid flow in high-power LED packaging and applications [J];LUO;Progress in Energy and Combustion Science,2016

4. Simplified mathematical model of a novel ‘closed loop two-phase wicked thermosyphon (CLTPWT)’ [J];REMELLA;International Journal of Thermal Sciences,2017

5. Thermal measurements and analyses of low-cost high-power LED packages and their modules [J];TSAI;Microelectronics Reliability,2012

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2. Heat Transfer Performance and Structural Optimization of a Novel Micro-channel Heat Sink;Chinese Journal of Mechanical Engineering;2022-04-11

3. Finite Element Simulation of the Machining Process of Boiling Structures in a Novel Radial Heat Sink for High-Power LEDs;Materials;2020-09-07

4. Numerical Simulation, Machining and Testing of a Phase Change Heat Sink for High Power LEDs;Materials;2019-07-08

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