Thermal aware runtime management of 3D memory architecture
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Earth and Planetary Sciences,General Engineering,General Environmental Science
Link
http://link.springer.com/content/pdf/10.1007/s40012-017-0156-x.pdf
Reference19 articles.
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3. Carlson TE, Heirman W, Eyerman S, Hur I, Eeckhout L (2014) An evaluation of high-level mechanistic core models. ACM Trans Archit Code Optim (TACO). doi: 10.1145/2629677
4. Conway P, Kalyanasundharam N, Donley G, Lepak K, Hughes B (2009) Blade computing with the AMD opteron processor (“magny-cours”). In: 2009 IEEE Hot Chips 21 Symposium (HCS), pp 1–19. doi: 10.1109/HOTCHIPS.2009.7478349
5. Huang M, Renau J, Yoo SM, Torrellas J (2000) A framework for dynamic energy efficiency and temperature management. In: Proceedings of the 33rd annual ACM/IEEE international symposium on microarchitecture, MICRO 33. ACM, New York, pp 202–213. doi: 10.1145/360128.360149
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