Author:
Faraji Soheila,Rahim Afidah Abdul,Mohamed Norita,Sipaut Coswald Stephen
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Geochemistry and Petrology,Mechanical Engineering,Mechanics of Materials
Reference34 articles.
1. G.O. Mallory and J.B. Hadju, Electroless Plating-Fundamentals and Applications, Noyes Publications, New York, 1990.
2. N. Li, Applied Technology of Electroless Plating, Chemical Industry Press, Beijing, 2003, p.10.
3. S.S. Wu, W.L. Liu, T.K. Tsai, et al., Growth behavior of electroless copper on silicon substrate, J. Univ. Sci. Technol. Beijing, 14(2007), No.1, p.67.
4. D. Li, K. Goodwin and C.L. Yang, Electroless copper deposition on aluminum-seeded ABS plastics, J. Mater. Sci., 43(2008), No.22, p.7121.
5. C. Ma, W. Ye, X. Shi, et al., Comparative study of electroless copper deposition based on the seed layers of Pd, PtPd and AuPd, Appl. Surf. Sci., 255(2009), No.6, p.3713.
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