Electroless copper deposition on aluminum-seeded ABS plastics-Reference-Cited by-同舟云学术

Electroless copper deposition on aluminum-seeded ABS plastics

Published:2008-11 Issue:22 Volume:43 Page:7121-7131
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Li Dapeng,Goodwin Kate,Yang Chen-Lu

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s10853-008-3031-1.pdf

Reference14 articles.

1. Kuzmik JJ (1990) In: Mallory GO, Hajdu JB (eds) Electroless plating: fundamentals and applications (Reprint Edition). The American Electroplaters and Surface Finishers Society, pp 377–399

2. Weng DC, Landau U (1995) Direct electroplating on nonconductors. J Electrochem Soci 142(8):2598

3. Viswanathan B (1993) Metallization of plastics by electroless plating. Curr Sci 65(7):537

4. Deckert CA (1995) Electroless copper plating - a review. 1. Plat Surf Finish 82(2):48

5. Deckert CA (1995) Electroless copper plating - a review. 2. Plat Surf Finish 82(3):58

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