Morphological evolution of tunnel tips for aluminum foils during DC etching-Reference-Cited by-同舟云学术

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Morphological evolution of tunnel tips for aluminum foils during DC etching

Published:2013-10 Issue:10 Volume:20 Page:961-966
ISSN:1674-4799
Container-title:International Journal of Minerals, Metallurgy, and Materials
language:en
Short-container-title:Int J Miner Metall Mater

Author:

Liang Li-bo,He Ye-dong,Song Hong-zhou,Yang Xiao-fei,Cai Xiao-yu

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Geochemistry and Petrology,Mechanical Engineering,Mechanics of Materials

Link

http://link.springer.com/content/pdf/10.1007/s12613-013-0821-5.pdf

Reference21 articles.

1. R.S. Alwitt, H. Uchi, T.R. Beck, and R.C. Alkire, Electrochemical tunnel etching of aluminum, J. Electrochem. Soc., 131(1984), No. 1, p. 13.

2. K. Hebert and R. Alkire, Growth rates of aluminum etch tunnels, J. Electrochem. Soc., 135(1988), No. 10, p. 2447.

3. E. Makino, T. Yajima, T. Shibata, M. Ikeda, Y. Tanno, and E. Suganuma, In situ observations of growing pits during tunnel etching of aluminum, Mater. Trans. JIM, 34(1993), No. 9, p. 796.

4. Z. Szklarska-Smialowska, Pitting corrosion of aluminum, Corros. Sci., 41(1999), No. 9, p. 1743.

5. N. Osawa and K. Fukuoka, Pit nucleation behavior of aluminium foil for electrolytic capacitors during early stage of DC etching, Corros. Sci., 42(2000), No. 3, p. 585.

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3. Effect of tunnel structure on the specific capacitance of etched aluminum foil;International Journal of Minerals, Metallurgy, and Materials;2014-10

4. Research on Pinholes in Aluminum Foil;Advanced Materials Research;2014-01

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