Low dielectric constant materials for advanced interconnects

Author:

Morgen Michael,Zhao Jie-Hua,Hu Chuan,Cho Taiheui,Ho Paul S.,Todd E.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Reference52 articles.

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3. J.G. Ryan et al., IBM J. Res. Develop., 39 (4) (1995), p. 371.

4. D. Edelstein et al., Proc. IEEE International Electron Device Meeting (New York: IEEE, 1997), p. 773.

5. S. Venkatesan et al., IEEE International Electron Device Meeting (New York: IEEE, 1997), pp. 769.

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