The Influence of Creep Induced Grain Boundary Separation on Electrical Non-destructive Evaluation Measurements
Author:
Funder
engineering and physical sciences research council
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Link
https://link.springer.com/content/pdf/10.1007/s10921-022-00855-4.pdf
Reference38 articles.
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3. Saxena, A.: Electrical potential technique for monitoring subcritical crack growth at elevated temperatures. Eng. Fract. Mech. 13(4), 741 (1980)
4. Dogan, B., Nikbin, K., Petrovski, B., Ceyhan, U., Dean, D.W.: Code of practice for high-temperature testing of weldments. Int. J. Press. Vessel. Pip. 83, 784–797 (2006). https://doi.org/10.1016/j.ijpvp.2006.08.011
5. Pelloux, R.M., Peltier, J.M., Zilberstein, V.: Creep testing of 2.25 Cr-1 Mo welds by DC potential drop technique. J. Eng. Mater. Technol. 111(1), 19 (1989). https://doi.org/10.1115/1.3226426
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