Abstract
Abstract
In this paper, superfine SiO2 nanoparticles are utilized as composite abrasive additive to improve the polishing property of CeO2, which is prepared through chemical precipitation method by rare-earth chloride as raw materials, silicofluoric acid as fluoride, Na2CO3 as modifier, and NH4HCO3 as precipitator. XRD, SEM, particle size analyzer, and atomic force microscopy are applied to characterize the physical structure, morphology, and size distribution. Furthermore, the as-prepared composite abrasive is used to perform chemical mechanical polishing (CMP) experiment on K9 glass to identify the impact of different mass fraction of SiO2 on the CMP property of work materials. The results show that the composite abrasive contained 0.5% SiO2 has the best polishing property, the surface roughness, and material removal rate of glass after polishing can reach at 1.3157 nm and 22.6 nm/min, respectively.
Funder
the National Natural Science Foundation of China
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Cell Biology,Physical and Theoretical Chemistry,Materials Science (miscellaneous),Atomic and Molecular Physics, and Optics,Biotechnology
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