Prediction and Regulation of Delamination at Flexible Film/Finite-Thickness-Substrate Structure Interfaces
Author:
Funder
Practice and Innovation Funds for Graduate Students of Northwestern Polytechnical University
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Computational Mechanics
Link
https://link.springer.com/content/pdf/10.1007/s10338-023-00437-5.pdf
Reference33 articles.
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3. Jian W, Wang ZX, Jin P, Zhu LJ, Chen Y, Feng X. Subsurface damage and bending strength analysis for ultra-thin and flexible silicon chips. Sci China-Technol Sci. 2023;66(1):215–22.
4. Xue ZG, Song HL, Rogers JA, Zhang YH, Huang YG. Mechanically-guided structural designs in stretchable inorganic electronics. Adv Mater. 2020;32(15):1902254.
5. Yoo JY, Yang JS, Chung MK, Kim SH, Yoon JB. A review of geometric and structural design for reliable flexible electronics. J Micromech Microeng. 2021;31(7):074001.
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