The effects of stabilizing additives on the microstructure and properties of electroless copper deposits-Reference-Cited by-同舟云学术

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The effects of stabilizing additives on the microstructure and properties of electroless copper deposits

Published:1974-05 Issue:5 Volume:5 Page:1215-1223
ISSN:1073-5615
Container-title:Metallurgical and Materials Transactions B
language:en
Short-container-title:Metall Mater Trans B

Author:

Aycock T. L.,Huie N. C.,Krauss George

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

https://link.springer.com/content/pdf/10.1007/BF02644336.pdf

Reference25 articles.

1. D. J. Sharp:Plating, 1971, vol. 58, p. 786.

2. N. Feldstein:, 1970, vol. 59, p. 803.

3. M. C. Agens: U. S. Patent No. 2,938,805 (1960).

4. J. L. Morico and H. W. Pender: U. S. Patent No. 3,595,684 (1971).

5. R. L. Zeblisky et al.: U. S. Patent No. 3,310,430(1967).

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The effect of 2-mercaptobenzothiazole on laser-assisted electroless copper plating;RSC Advances;2016

2. Prevention of blister formation in electrolessly deposited copper film on organic substrates;Korean Journal of Chemical Engineering;2012-01-07

3. MORPHOLOGY AND INTERFACIAL ADHESION STRENGTH OF Cu-COATED CARBON FIBRES;Canadian Metallurgical Quarterly;2003-01

4. Morphological and Chemical Comparisons of Electroless Nickel and Electroless Copper Film Growth;Transactions of the IMF;1994-01

5. Effect of the Type of Substrates on the Ductility and Microstructure of Electroless Copper Deposits;Journal of The Electrochemical Society;1993-02-01

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