Morphological and Chemical Comparisons of Electroless Nickel and Electroless Copper Film Growth
Author:
Publisher
Informa UK Limited
Subject
Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Link
https://www.tandfonline.com/doi/pdf/10.1080/00202967.1994.11871027
Reference23 articles.
1. Generative and Stabilizing Processes in Tin-Palladium Sols and Palladium Sol Sensitizers
2. C.R. Shipley, Jr.U.S. Patent3,011,920 (Dec. 5, 1961).
3. Hydrous melt catalyst synthesis
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