Co-enhancement of thermal conduction and radiation through morphologies controlling of graphene functional layer for chip thermal management-Reference-Cited by-同舟云学术

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Co-enhancement of thermal conduction and radiation through morphologies controlling of graphene functional layer for chip thermal management

Published:2024-04-04 Issue: Volume: Page:
ISSN:1998-0124
Container-title:Nano Research
language:en
Short-container-title:Nano Res.

Author:

Cheng Shuting,Wang Kun,Xu Shichen,Cheng Yi,Liu Ruojuan,Huang Kewen,Yuan Hao,Li Wenjuan,Yang Yuyao,Liang Fushun,Yang Fan,Zheng Kangyi,Liang Zhiwei,Tu Ce,Liu Mengxiong,Yang Xiaomin,Wang Jingnan,Gai Xuzhao,Zhao Yuejie,Wang Xiaobai,Qi Yue,Liu Zhongfan

Publisher

Springer Science and Business Media LLC

Link

https://link.springer.com/content/pdf/10.1007/s12274-024-6540-6.pdf

Reference44 articles.

1. Li, S.; Zheng, Q. Y.; Lv, Y. C.; Liu, X. Y.; Wang, X. Q.; Huang, P. Y.; Cahill, D. G.; Lv, B. High thermal conductivity in cubic boron arsenide crystals. Science 2018, 361, 579–581.

2. Cho, J.; Goodson, K. E. Cool electronics. Nat. Mater., 2015, 14, 136–137.

3. Garimella, S. V.; Yeh, L. T.; Persoons, T. Thermal management challenges in telecommunication systems and data centers. IEEE Trans. Compon. Packag. Manuf. Technol. 2012, 2, 1307–1316.

4. Weng, Y. Z. W.; Wu, S. C.; Wang, L. B.; Zhao, W. Y.; Jiang, Y.; Deng, Y. An efficient cooling solution with 3D interconnected graphene architectures for passive heat dissipation. J. Mater. Chem. C 2022, 10, 13167–13173.

5. Balandin, A. A. Thermal properties of graphene and nanostructured carbon materials. Nat. Mater. 2011, 10, 569–581.

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