An efficient cooling solution with 3D interconnected graphene architectures for passive heat dissipation-Reference-Cited by-同舟云学术

An efficient cooling solution with 3D interconnected graphene architectures for passive heat dissipation

Published:2022 Issue:36 Volume:10 Page:13167-13173
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Weng Yangziwan¹,Wu Sicheng¹^ORCID,Wang Linbin¹,Zhao Weiyun¹^ORCID,Jiang Yi¹^ORCID,Deng Yuan¹²^ORCID

Affiliation:

1. Key Laboratory of Intelligent Sensing Materials and Chip Integration Technology of Zhejiang Province, Hangzhou Innovation Institute of Beihang University, Hangzhou 310051, China

2. Research Institute for Frontier Science, Beihang University, Beijing, 100083, China

Abstract

A 3D hybridized reduced graphene oxide membrane (AR-rGO) was fabricated using a convenient electrochemical deposition method, which possesses a highly efficient passive heat dissipation capability.

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2022/TC/D2TC01524B

Reference46 articles.

1. Enhancing the Heat-Dissipation Efficiency in Ultrasonic Transducers via Embedding Vertically Oriented Graphene-Based Porcelain Radiators

2. Graphene Field‐Effect Transistors on Hexagonal‐Boron Nitride for Enhanced Interfacial Thermal Dissipation