Interface crack between a thin film and an orthotropic substrate under uniform heat flow
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering
Link
http://link.springer.com/content/pdf/10.1007/s00419-015-1076-6.pdf
Reference18 articles.
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3. Evans, A.G., Mumm, D.R., Hutchinson, J.W., Meier, G.H., Pettit, F.S.: Mechanics controlling the durability of the thermal barrier coatings. Prog. Mater. Sci. 46, 505–553 (2001)
4. Khandelwal, R., Kishen, J.C.: Computation of thermal stress intensity factors for bimaterial interface cracks using domain integral method. J. Appl. Mech. 76, 041010 (2009)
5. Comninou, M., Dundurs, J.: On lack of uniqueness in hear conduction through a solid to solid contact. J. Heat Transf. 102, 319–323 (1980)
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