Mathematical modeling of nanomachining with bimodal dynamic scanning thermal microscope probe
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering
Link
https://link.springer.com/content/pdf/10.1007/s00419-022-02127-z.pdf
Reference27 articles.
1. Lui, T., Yang, B.: Thermography techniques for integrated circuits and semiconductor devices. Sens. Rev. 27, 298–309 (2007). https://doi.org/10.1108/02602280710821434
2. Juszczyk, J., Kaźmierczak-Bałata, A., Firek, P., Bodzenta, J.: Measuring thermal conductivity of thin films by Scanning Thermal Microscopy combined with thermal spreading resistance analysis. Ultramicroscopy 175, 81–86 (2017). https://doi.org/10.1016/j.ultramic.2017.01.012
3. Janus, P., Sierakowski, A., Grabiec, P., Rudek, M., Majstrzyk, W., Gotszalk, T.: Micromachined active test structure for scanning thermal microscopy probes characterization. Microelectron. Eng. 174, 70–73 (2017). https://doi.org/10.1016/j.mee.2017.02.010
4. Nguyen, T.P., Lemaire, E., Euphrasie, S., Thiery, L., Teyssieux, D., Briand, D., Vairac, P.: Microfabricated high temperature sensing platform dedicated to Scanning Thermal Microscopy (SThM). Sensors Actuators A Phys. 275, 109–118 (2018). https://doi.org/10.1016/j.sna.2018.04.011
5. Wielgoszewski, G., Gotszalk, T.: Chapter Four-Scanning Thermal Microscopy (SThM): how to map temperature and thermal properties at the nanoscale. Adv. Imaging Electron. Phys. 190, 177–221 (2015). https://doi.org/10.1016/bs.aiep.2015.03.011
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