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Springer Science and Business Media LLC
Reference26 articles.
1. Davidson, B.D., Sundararaman, V.: A single-leg bending test for interfacial fracture toughness determination. Int J Fract 78, 193–210 (1996)
2. Yeung, D.T.S., Lam, D.C.C., Yuen, M.M.F.: Specimen design for mixed mode interfacial fracture properties measurement in electronic packages. J Electr Packag 122, 67–72 (2000)
3. Narin, J.A.: Energy release rate analysis of adhesive and laminate double cantilever beam specimens emphasizing the effect of residual stresses. Int J Adhes Adhes 20, 59–70 (1999)
4. Guadette, F.G., Giannapoulos, A.E., Suresh, S.: Interfacial cracks in layered materials subjected to a uniform temperature change. Int J Fract 28, 5620–5629 (2001)
5. Jiao, J., Gurumurthy, G.K., Kramer, E.J., Sha, Y., Hui, C.Y., Borgesen, P.: Measurement of interfacial fracture toughness under combined mechanical and thermal stress. J Electron Packag 120, 325–349 (1998)
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