Fracture analysis of mode III crack problems for the piezoelectric bimorph
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering
Link
http://link.springer.com/content/pdf/10.1007/s00419-014-0848-8.pdf
Reference38 articles.
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3. Li X.F., Fan T.Y.: Mode-III interface edge crack between two bonded quarter-planes of dissimilar piezoelectric materials. Arch. Appl. Mech. 71, 703–714 (2001)
4. Hu K.Q., Zhong Z., Jin B.: Anti-plane shear crack in a functionally gradient piezoelectric layer bonded to dissimilar half spaces. Int. J. Mech. Sci. 47, 82–93 (2005)
5. Narita F., Shindo Y., Watanabe K.: Anti-plane shear crack in a piezoelectric layer bonded to dissimilar half spaces. JSME Int. J. Ser. A Solid Mech. Mater. Eng. 42, 66–72 (1999)
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