COD Reduction in Semiconductor Wastewater by Natural and Commercialized Coagulants Using Response Surface Methodology-Reference-Cited by-同舟云学术

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COD Reduction in Semiconductor Wastewater by Natural and Commercialized Coagulants Using Response Surface Methodology

Published:2008-07-13 Issue:1-4 Volume:195 Page:345-352
ISSN:0049-6979
Container-title:Water, Air, and Soil Pollution
language:en
Short-container-title:Water Air Soil Pollut

Author:

Omar Fatehah Mohd,Rahman Nik Norulaini Nik Abdul,Ahmad Anees

Publisher

Springer Science and Business Media LLC

Subject

Pollution,Water Science and Technology,Ecological Modeling,Environmental Chemistry,Environmental Engineering

Link

http://link.springer.com/content/pdf/10.1007/s11270-008-9751-7.pdf

Reference15 articles.

1. Aguilar, M. I., Saez, J., Llorens, M., Soler, A., & Ortuno, J. F. (2003). Microscopic observations of particle reduction in slaughterhouse wastewater by coagulation-flocculation using ferric sulphate as coagulant and different coagulant aids. Water Research, 37, 2233–2241.

2. Bratskaya, S., Schwarz, S., Liebert, T., & Heinze, T. (2005). Starch derivatives of high degree of functionalization 10. Flocculation of kaolin dispersions. Colloids and Surfaces. A: Physicochemical and Engineering Aspects, 254, 75–80.

3. Hollingsworth, J., Sierra-Alvarez, R., Zhou, M., Ogden, K. L., & Field, J. A. (2005). Anaerobic biodegradability and methanogenic toxicity of key constituents in copper chemical mechanical planarization effluents of the semiconductor industry. Chemosphere, 59, 1219–1228.

4. Lai, C. L., & Lin, S. H. (2003). Electrocoagulation of chemical mechanical polishing (CMP) wastewater from semiconductor fabrication. The Chemical Engineering Journal, 95, 205–211.

5. Lai, C. L., & Lin, S. H. (2004). Treatment of chemical mechanical polishing wastewater by electrocoagulation system performances and sludge settling characteristics. Chemosphere, 54, 235–242.

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