The effect of thermal exposure on the microstructure an fiber/matrix interface of an AI2O3/AI composite-Reference-Cited by-同舟云学术

The effect of thermal exposure on the microstructure an fiber/matrix interface of an AI2O3/AI composite

Published:1986-06 Issue:6 Volume:17 Page:1075-1080
ISSN:0360-2133
Container-title:Metallurgical Transactions A
language:en
Short-container-title:MTA

Author:

Hall I. W.,Barrailler V.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF02661274.pdf

Reference14 articles.

1. G.C. Olsen:Proc. 24th National S.A.M.P.E. Symposium, S.A.M.P.E., Covina, CA, 1979, vol. 2, pp. 1069–80.

2. W. H. Kim, M. J. Koczak, and A. Lawley:Proc. 2nd Int. Conf. Comp. Matls., Toronto, ON, TMS-AIME, Warrendale, PA, 1978, pp. 487–505.

3. A. Skinner, M.J. Koczak, and A. Lawley:Metall. Trans. A, 1982, vol. 13A, pp. 289–97.

4. A. R. Champion, W. H. Krueger, H. S. Hartman, and A. K. Dhingra:Proc. 2nd Int. Conf. Comp. Matls., Toronto, ON, TMS-AIME, Warrendale, PA, 1978, pp. 883–905.

5. K.M. Prewo: TR R77-912245-3, United Technologies Res. Ctr., East Hartford, CT, 1977.

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