Funder
Ministry of Electronics and Information technology
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Modelling and Simulation,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference43 articles.
1. Engelhardt, M., Traving, M., Steinhögl, W., Steinlesberger, G., Schindler, G.: Comprehensive study of the resistivity of copper wires with lateral dimensions of 100nm and smaller. J. Appl. Phys. 97(2), 023706 (2005)
2. Zhang, J., Friedman, E.G.: Crosstalk modeling for coupled RLC interconnects with application to shield insertion. IEEE Trans. Very Large Scale Integr. Syst. 14(6), 641–646 (2006)
3. Vittal, A., Marek-Sadowska, M.: “Crosstalk reduction for VLSI. IEEE Trans. Comput. Des. Integr. Circuits Syst. 16(3), 290–298 (1997)
4. Noise, S., Salman, E., Friedman, E.G.: Shielding methodologies in the presence of power/ground noise. Techniques 19(8), 1–11 (2011)
5. Kumar, M.G., Agrawal, Y., Chandel, R.: Carbon nanotube interconnects—a promising solution for VLSI circuits. IETE J. Educ. 57(2), 46–64 (2016)
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献