Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Link
https://link.springer.com/content/pdf/10.1007/s12206-021-1042-x.pdf
Reference92 articles.
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3. X. Dai et al., Reliability design of direct liquid cooled power semiconductor module for hybrid and electric vehicles, Microelectron. Reliab., 64(SI) (2016) 474–478.
4. G. Coquery et al., High temperature reliability on automotive power modules verified by power cycling tests up to 150 degrees C, Microelectron. Reliab., 43(9–11) (2003) 1871–1876.
5. R. Bayerer, Advanced packaging yields higher performance and reliability in power electronics, Microelectron. Reliab., 50(9–11, SI) (2010) 1715–1719.
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