Author:
Oh Hyuck-Keun,Kang Sae Byul,Choi Young Ki,Lee Joon Sik
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Reference9 articles.
1. Y. T. Kim, K. R. Jung, H. Y. Kim, H. T. Kim and H. J. Yoo, Development and application of rapid thermal processing, Journal of KIEE (in Korean) 10(9) (1988) 1051–1058.
2. H. A. Lord, Thermal and stress analysis of semiconductor wafers in a rapid thermal processing oven, IEEE Transactions on Semiconductor Manufacturing, 11(3) (1988) 105–114.
3. S. A. Campbell, K. L. Knutson, K. H. Ahn, J. D. Leighton and B. Y. H. Liu, Gas flow patterns and thermal uniformity in rapid thermal processing equipment, International Electron Devices Meeting, (1990) 921–924.
4. S. A. Campbell, K. H. Ahn, K. L. Knutson, B. Y. H. Liu and J. D. Leighton, Steady-state thermal uniformity and gas flow patterns in a rapid thermal processing chamber, IEEE Transactions on Semiconductor Manufacturing, 4(1) (1992) 14–20.
5. S. A. Norman, Optimization of transient temperature uniformity in RTP Systems, IEEE Transactions on Electron Devices, 39(1) (1992) 205–207.
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