Author:
Kim In,Cho Sungeun,Jung Dogyun,Lee Cheul Ro,Kim Daesuk,Baek Byung Joon
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Reference12 articles.
1. W. H. Chi, T. L. Chou, C. N. Han, S. Y. Yang and K. N. Chiang, Analysis of thermal and luminous performance of MR-16 LED lighting module, IEEE Trans, Compon. Pack. Tech., 33(4) (2010) 713–721.
2. J. Senawiratne, Y. Li, M. Zhu, Y. Xia, W. Zhao, T. Detchprohm, A. Chatterjee, J. L. Plawsky and C. Wetzel, Junction temperature measurements and thermal modeling GaInN/GaN quantum well Light Emitting Diodes, Journal of Electronic Materials, 37(5) (2008) 607–610.
3. B. Fan, H. Wu, Y. Zhao, Y. Xian and G. Wang, Study of phosphor thermal-isolated packing technologies for high-power white Light-Emitting Diodes, IEEE Photonics Technology Letters, 19(15) (2007) 1121–1123.
4. K. C. Chen, Y. K. Su, C. L. Lin, Y. Lu, W. Li, W. Chuang, J. Q. Huang and S. M. Chen, Thermal management and novel package design of high power light-emitting diodes, Electronic Components and Technology Conference, Florida, May (2008) 795–797.
5. A. A. Karim, P. P. A. Narayana and K. N. Seetharamu, Thermal analysis of LED package, Microelectronics Inter-national, 23(1) (2006) 19–25.
Cited by
13 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献