1. P. Pauli, J. G. Beesley, U. P. Schonholzer and U. kerat, Swiss wafer slicing technology for the global PV market from meyer burger AG novel trends for the future in photovoltaic wafer manufacturing, 6th Symposium Photovoltaïque National, Swiss (2005).
2. I. Kao, Technology and research of slurry wire saw manufacturing systems in wafer slicing with free abrasive machining, Int. J. Adv. Manuf. Syst., 7 (2) (2004) 7–20.
3. J. Webster, J. Qu and A. Shih, Fixed abrasive diamond wire saw slicing of single-crystal silicon carbide wafers, Materials and Manufacturing Process, 19 (2004) 597–617.
4. Y. Chiba, Y. Tani, T. Enomoto and H. Sato, Development of a high speed manufacturing method for electroplated diamond wire tools, CIRP Annals, 52 (1) (2003) 281–284.
5. W. S. Chu, C. S. Kim, H. T. Lee, J. O. Choi, J. I. Park, J. H. Song, K. H. Jang and S. H. Ahn, Hybrid manufacturing in micro/nano scale: A review, International Journal of Precision Engineering and Manufacturing - Green Technology, 1 (1) (2014) 75–92.