Author:
Kim Daehyeon,Kim Youngjin,Kim Hyeongrae,Kim Juyeon,Kang Jongmo,Choi Yuchang,Oh Dongho
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Reference13 articles.
1. J. U. Park and J. S. Park, The present status and future aspects of the market for printed electronics, The Korea Institute of Information and Communication Engineering, 17(2) (2013) 263–272.
2. Y. Y. No, H. Han, G.-T. Bae, A.-R. Jo and H.-M. Lee, Print backplane TFT development trend and outlook for flexible display, Information Display, 11(6) (2010) 2–11.
3. Y. M. Choi, E. S. Lee and T. M. Lee, Mechanism of reverse-offset printing, Micromechanics and Micro Engineering, 25 (7) (2015).
4. S. H. Ahn and L. J. Guo, Large-area roll-to-roll and roll-to-plate nanoimprint lithography: a step toward high throughput application of continuous nanoimprinting, ACS Nano (2009) 2304–2310.
5. C. W. Lee, H. K. Kang and K. H. Kang, A study on tension behavior considering thermal effects in roll-to-roll E-printing, Mechanical Science and Technology, 24(5) (2010) 1097–1103.