Solder flow on narrow copper strips-Reference-Cited by-同舟云学术

Solder flow on narrow copper strips

Published:1996-07 Issue:7 Volume:25 Page:1099-1107
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Hosking F. M.,Yost F. G.,Holm E. A.,Michael J. R.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02659910.pdf

Reference17 articles.

1. R.J. Klein Wassink, Soldering in Electronics, 2nd ed. (Electrochemical Publications Limited, 1989), pp. 36 and 300.

2. C. Lea, A Scientific Guide to Surface Mount Technology, (Electrochemical Publications Limited, 1988), p. 308.

3. Solderability Tests for Printed Boards, ANSI-J-STD-003, (The Institute for Interconnecting and Packaging Electronic Circuits and Electronic Industries Association, (1992).

4. The Mechanics of Solder Alloy Wetting and Spreading, eds. F.G. Yost, F.M. Hosking and D.R. Frear, (Van Nostrand Reinhold,1993), p. 9.

5. F.M. Hosking,F.G.Yost, C.L. Hernandez, and S.J. Sackinger, Capillary Flow Solderability Test for Printed Wiring Boards, Sandia Report SAND94-0603, (April, 1994).

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