Effect of thermal residual stress on the crack path in adhesively bonded joints
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/BF00687277.pdf
Reference22 articles.
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3. N. A. FLECK, J. W. HUTCHINSON and Z. SUO,Int. J. Solids Struct. 27 (1991) 1683.
4. A. R. AKISANYA and N. A. FLECK,Int. J. Fract. 55 (1992) 29.
5. H. CHAI,ibid. 32 (1987) 211.
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