Effect of rubber modification on fracture toughness of epoxy adhesives under mode I and mode II loading
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,Mechanical Engineering,Condensed Matter Physics,General Materials Science
Reference30 articles.
1. Mode-I fracture behavior of adhesive joints. Part 1. Relationship between fracture energy and bond thickness;Daghyani;J. Adhes.,1995
2. Effect of thermal residual stress on the crack path in adhesively bonded joints;Daghyani;J. Mater. Sci.,1996
3. Effect of molecular weight between crosslinks on the fracture behavior of rubber-toughened epoxy adhesives;Kang;J. Appl. Polym. Sci.,2001
4. The calculation of adhesive fracture energies in mode I : revisiting the tapered double cantilever beam (TDCB) test;Blackman;Eng. Frac. Mech.,2003
5. Fracture Behavior around a Crack Tip in Rubber-Modified Epoxy Adhesive Joint with Various Bond Thicknesses;Lee;J. Mat. Sci. Lett.,2003
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1. Lignin-based silicone-modified epoxy resin with enhanced strength and toughness;International Journal of Adhesion and Adhesives;2024-01
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