Author:
Röhrich Adrian,Rössle Christian
Publisher
Springer Science and Business Media LLC
Cited by
2 articles.
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1. Measuring of parasitic resistance of stacked chip of Si power device;2023 35th International Conference on Microelectronic Test Structure (ICMTS);2023-03-27
2. Packaging Technologies for HPC/AI Applications in New Intelligence Era;Journal of The Japan Institute of Electronics Packaging;2020-11-01