1. 4) H.-S. P. Wong: "IC Technology – What Will the Next Node Offer Us?," Hot Chips 2019 Symposium Presentation
2. 5) L. Su: "Delivering The Future of High-Performance Computing," Hot Chips 2019 Symposium Presentation
3. 6) D. Gennermann: "INNOVATON IN DER PCB-TECHNOLOGIE," 25.10.2017, Presentation Material
4. 7) A. Röhrich and C. Rössle: "Chip Embedding of Power Semiconductors in Power Ciruit Boards," DEVELOPMENT POWER ELECTRONICS, pp. 56–59
5. 8) R. Merte: "The breakthrough in 48 V interconnect-technology and its roadmap to high voltage solutions," October 15, 2019, Presentation Material