Author:
Wang Yiwei,Cen Jiwen,Jiang Fangming,Zhu Xiong
Publisher
Springer Science and Business Media LLC
Reference23 articles.
1. C.C. Shih, C.C. Chen, C.C. Chang, S.L. Chen, (2012), Dynamic test strategy for diagnosing a heat pipe cooling module, Int. J. Heat Mass Transfer, vol. 39, pp. 494–503.
2. M. Faraji, H. EL Qarnia, El K. Lakhal, (2009), Thermal analysis of a phase change material based heat sink for cooling protruding electronic chips, J. Thermal Science, vol. 18, pp. 268–275.
3. C.S. Sharma, S. Zimmermann, M.K. Tiwari, B. Michel, D. Poulikakos, (2012), Optimal thermal operation of liquid-cooled electronic chips, Int. J. Heat Mass Transfer, vol. 55, pp. 1957–1969.
4. C.F. Hu, J. Li, (2011), Experimental study on the start up performance of flat plate pulsating heat pipe, J. Thermal Science, vol. 20, pp. 150–154.
5. Y.W. Wang, P.J. Niu, J.X. Zhang, J.R. Liu, (2010), Recent development status of high-power LED heat release technology, 2010 Asia-Pacific Youth Conference on Communication. Yun-Nan, China, pp. 205–208.
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献