Non-contact evaluation of the resonant frequency of a microstructure using ultrasonic wave-Reference-Cited by-同舟云学术

Non-contact evaluation of the resonant frequency of a microstructure using ultrasonic wave

Published:2009-09-18 Issue:2 Volume:26 Page:317-323
ISSN:0567-7718
Container-title:Acta Mechanica Sinica
language:en
Short-container-title:Acta Mech Sin

Author:

Kang X.,He X. Y.,Tay C. J.,Quan C.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Computational Mechanics

Link

http://link.springer.com/content/pdf/10.1007/s10409-009-0300-4.pdf

Reference16 articles.

1. Ngoi B.K.A., Venkatakrishnan K., Tan B., Noël N., Shen Z.W., Chin C.S.: Two-axis-scanning laser Doppler vibrometer for microstructure. Opt. Commun. 182, 175–185 (2000)

2. Rembe C., Kant R., Muller R.S.: Optical measurement methods to study dynamic behavior in MEMS. Proc. SPIE 4400, 127–137 (2001)

3. Burdess J.S., Harris A.J., Wood D., Pitcher R.J., David G.: A system for the dynamic characterization of microstructure. J. MEMS 4, 322–328 (1997)

4. Castellini, P., Marchetti, B., Margesin, B.: Scanning laser Doppler vibrometer for vibrational analysis of micro-electro-mechanical-systems (MEMS). In: Proceedings of ISMA, pp. 2281–2287 (2004)

5. Cannella F., Marchetti B.: Evaluation of thermal loading effects of laser Doppler vibrometer applied to micro-electro-mechanical systems (MEMS). Proc. SPIE 5503, 468–477 (2004)

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