A three-layer structure model for the effect of a soft middle layer on Love waves propagating in layered piezoelectric systems
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Computational Mechanics
Link
http://link.springer.com/content/pdf/10.1007/s10409-012-0120-9.pdf
Reference32 articles.
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4. Takagi, H., Maeda, R., Suga, T.: Room-temperature wafer bonding of Si to LiNbO3, LiTaO3 and Gd3Ga5O12 by Ar-beam surface activation. Journal of Micromechanics and Microengineering 11, 348–352 (2001)
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