A Numerical Investigation of Heat Suppression in HEMT for Power Electronics Application

Author:

Arivazhagan L.,Nirmal D.ORCID,Reddy P. Pavan Kumar,Ajayan J.,Godfrey D.,Prajoon P.,Ray Ashok

Publisher

Springer Science and Business Media LLC

Subject

Electronic, Optical and Magnetic Materials

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Partial etched AlGaN layer on p-GaN HEMT with gate field plate and drain field plate for channel temperature reduction;2022 19th China International Forum on Solid State Lighting & 2022 8th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS);2023-02-07

2. Ballistic Thermal Transport at Sub‐10 nm Laser‐Induced Hot Spots in GaN Crystal;Advanced Science;2022-11-17

3. Thermal Performance Improvement of AlGaN/GaN HEMTs Using Nanocrystalline Diamond Capping Layers;Micromachines;2022-09-07

4. Analysis and improvement of self-heating effect based on GaN HEMT devices;Materials Research Express;2022-07-01

5. Access Region Stack Engineering for Mitigation of Degradation in AlGaN/GaN HEMTs With Field Plate;IEEE Transactions on Device and Materials Reliability;2022-03

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