Machining, Characterization and Optimization: A Novel Approach for Machining Channels on Silicon Wafer Using Tailor-Made Micro Abrasive Jet Machining-Reference-Cited by-同舟云学术

Machining, Characterization and Optimization: A Novel Approach for Machining Channels on Silicon Wafer Using Tailor-Made Micro Abrasive Jet Machining

Published:2021-03-06 Issue: Volume: Page:
ISSN:1876-990X
Container-title:Silicon
language:en
Short-container-title:Silicon

Author:

Tomy Anu,Hiremath Somashekhar S.^ORCID

Publisher

Springer Science and Business Media LLC

Subject

Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s12633-021-01036-0.pdf

Reference47 articles.

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3. Kovacs GT, Maluf NI, Petersen KE (1998) Bulk micromachining of silicon. Proc IEEE 86(8):1536–1551. https://doi.org/10.1109/5.704259

4. Kaminsky G (1985) Micromachining of silicon mechanical structures. J Vac Sci Technol B: Microelectron Process Phenom 3(4):1015–1024. https://doi.org/10.1116/1.583089

5. Hossinger A (2000) Simulation of ion implantation for ULSI technology, Tech. Univ. Vienna, Vienna, Austria. https://inis.iaea.org/search/search.aspx?orig_q=RN:33039479

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