Automatic Full Strain Field Moiré Interferometry Measurement with Nano-scale Resolution
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Aerospace Engineering
Link
http://link.springer.com/content/pdf/10.1007/s11340-008-9127-3.pdf
Reference26 articles.
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3. Morita Y, Arakawa K, Todo M (2007) High-sensitivity measurement of thermal deformation in a stacked multichip package. IEEE Trans Compon Packag Technol 30:137–143.
4. Han B, Kunthong P (2000) Micro-mechanical deformation analysis of surface laminar circuit in organic flip-chip package: an experimental study. Transactions of the ASME. J Electron Packag 122:294–300.
5. Guo Y, Lim CK, Chen WT, Woychik CG (1993) Solder ball connect (SBC) assemblies under thermal loading. I. Deformation measurement via moiré interferometry, and its interpretation. IBM J Res Develop 37:635–647.
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