Author:
Borza Dan N.,Gautrelet Christophe
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference51 articles.
1. The electronic packaging handbook,2000
2. Physics-of-failure: an approach to reliable product development;Pecht;J Inst Environ Sci,1995
3. Physics-of-failure-based prognostics for electronic products;Pecht;Trans Inst Meas Control,2009
4. Experimental investigation by speckle interferometry of solder joint failure under thermomechanical load aggravated by boundary conditions at board level;Borza;ASME J Electron Packag,2012
5. Snider D. Electronics component failure analysis – isolating failing components. 〈http://www.ial-fa.com/blog/electronics-component-failure-analysis-isolating-failing-components.htm〉; 2014.
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献