An Investigation of Fatigue Characteristics of Copper Film-Reference-Cited by-同舟云学术

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An Investigation of Fatigue Characteristics of Copper Film

Published:2010-10-16 Issue:7 Volume:51 Page:1033-1038
ISSN:0014-4851
Container-title:Experimental Mechanics
language:en
Short-container-title:Exp Mech

Author:

Huh Y. H.,Kim D. I.,Kim D. J.,Lee H. M.,Hong S. G.,Park J. H.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Aerospace Engineering

Link

http://link.springer.com/content/pdf/10.1007/s11340-010-9412-9.pdf

Reference13 articles.

1. Spearing SM (2000) Materials issues in microelectromechanical systems (MEMS). Acta Mater 48:179–196

2. Nix WD (1989) Mechanical properties of thin films. Metall Mater Trans 20A:2217–2245

3. Vinci RP, Vlassak JJ (1996) Mechanical behavior of thin films. Annu Rev Mater Sci 26:431–462

4. Kraft O, Volkert CA (2001) Mechanical testing of thin films and small structures. Adv Eng Mater 3:99–110

5. Sharpe WN, Bagdahn J (2004) Fatigue testing of polysilicon - a review. Mech Mater 36:3–11

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis of Dropper Stress in a Catenary System for a High-Speed Railway;Mathematical Problems in Engineering;2022-09-01

2. A micro-crack initiation life simulation method by improving the Tanaka-Mura's model of slip behavior;International Journal of Fatigue;2021-04

3. Fatigue life analysis of dropper used in pantograph-catenary system of high-speed railway;Advances in Mechanical Engineering;2018-05

4. Improved thermal stability and reliability of Cu film electrode induced by bias magnetron sputtering;Thin Solid Films;2016-10

5. Statistical Characteristics of Fatigue Failure of Copper Thin Films;Journal of Engineering Materials and Technology;2013-09-17

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